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FlexFilm: Real-time digital film processing with a FPGA-based reconfigurable platform

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Tool Name (abbreviation): 
FlexFilm
(unregistered) Author(s): 
Henning Sahlbach, sahlbach@ida.ing.tu-bs.de, IDA, Institut für Datentechnik und Kommunikationsnetze
Sean Whitty, IDA, Institut für Datentechnik und Kommunikationsnetze
Rolf Ernst, IDA, Institut für Datentechnik und Kommunikationsnetze

The European MORPHEUS project (IST 027342) addresses innovative solutions for embedded computing based on a dynamically reconfigurable computing platform and a corresponding toolset. This demonstration showcases the FlexFilm board, which is used as an intermediate platform for algorithms that will be ported to the MORPHEUS chip to demonstrate its capabilities as a high-performance reconfigurable architecture.

Project Information
Project Acronym: 
MORPHEUS
Project Start: 
Sun, 01/01/2006
Project End: 
Wed, 12/31/2008
Project Funding ID: 
FP6-IST-027342
Project Description: 
The Multi-purpOse dynamically Reconfigurable Platform for intensive HEterogeneous processing (MORPHEUS project) is an integrated project which addresses innovative solutions for embedded computing based on dynamically reconfigurable platforms and tools. The large-scale deployment of Embedded Systems is indeed raising new demanding requirements in terms of computing performance, cost-efficient development, low power, functional flexibility and sustainability. This results in an increasing complexity of the platforms and an enlarging design productivity gap: current solutions are out of breath while current development and programming tools do not support the time-to-market needs. MORPHEUS copes with these challenges by developing a global solution based on a modular heterogeneous SOC platform providing the disruptive technology of dynamically reconfigurable computing completed by a software oriented design flow and a consistent toolset. These "Soft Hardware" architectures will enable huge computing density improvements (GOPS/Watt,giga operations per second per Watt) by a factor of x100, reuse capabilities by x5, flexibility by more than 100 and time to market divided by 2 thanks to a convenient programming toolset. This will be achieved within a 3-years integrated project providing: * A modular silicon demostrator composed of complementary run-time reconfigurable building blocks to address the different types of application requirements * The corresponding integrated design flow supporting the fast exploration of hardware and software alternatives The suitability and the efficiency will be validated by a set of four compementary test cases: Broadband Wireless Access, Network routing, professional video, Homeland security. The dissemination through silicon offer and supporting tools (baseline for further commercial products) will be completed by specific training and broad information to address the necessary cultural change. This will be performed by a consortium where many partners are already involved in bilateral cooperation, and implemented along a 2-steps process to monitor the final content of the project according to state of the art and first results.